Product status | Preferred |
---|---|
Description | Chipset RSL10 BLE RADIO SIP MODULE |
Diameter / length [mm] | 8 |
Width [mm] | 6.00 |
Thickness [mm] | 1.46 |
Package | SIP-51 |
RF Protocol | Bluetooth v5.0 |
Memory [MB] | 384kB Flash memory |
Frenquency Band [MHz] | 2400-2480 |
Digital Comm I/O | I²C. SPI. UART |
Min. operating Temp. [°C] | -40 |
Max. operating Temp. [°C] | 85 |
MSL level | 3 |
Bluetooth 5.2
System-in-Package (SiP)
RSL10 SIP
Product status | Preferred |
---|---|
Description | Chipset RSL10 BLE RADIO SIP MODULE |
Diameter / length [mm] | 8 |
Width [mm] | 6.00 |
Thickness [mm] | 1.46 |
Package | SIP-51 |
RF Protocol | Bluetooth v5.0 |
Memory [MB] | 384kB Flash memory |
Frenquency Band [MHz] | 2400-2480 |
Digital Comm I/O | I²C. SPI. UART |
Min. operating Temp. [°C] | -40 |
Max. operating Temp. [°C] | 85 |
MSL level | 3 |
Bluetooth 5.2
System-in-Package (SiP)
RSL10 SIP
Product status | Preferred |
---|---|
Description | Chipset RSL10 BLE RADIO SIP MODULE |
Diameter / length [mm] | 8 |
Width [mm] | 6.00 |
Thickness [mm] | 1.46 |
Package | SIP-51 |
RF Protocol | Bluetooth v5.0 |
Memory [MB] | 384kB Flash memory |
Frenquency Band [MHz] | 2400-2480 |
Digital Comm I/O | I²C. SPI. UART |
Min. operating Temp. [°C] | -40 |
Max. operating Temp. [°C] | 85 |
MSL level | 3 |
Bluetooth 5.2
System-in-Package (SiP)
RSL10 SIP